Herrmann Ultrasonics Product Showcase

Herrmann Ultrasonics

Booth #811

Lower error ratio and improved production quality

Continuous welding of filtration material requires the highest level of precision. The Herrmann Ultrasonics MICROBOND CSI system, consisting of the VE Actuator, Microgap controller and high-performance ULTRABOND generator guarantees consistent weld quality. Integrated in all MICROBOND systems is the patented Microgap control process, which ensures constant production quality via closed loop processing by monitoring the gap between the sonotrode and the anvil drum.

  • The MICROBOND CSI technology energy is only directed to the weld bond points and does not further restrict the filter laminate, nor change the fiber content; with typical thermal bonding heat radiates outside the bond zone.
  • Small bond points safeguard against restricted airflow, a common problem when using adhesives.
  • Multi-laminate structures with/without mesh reinforcement can simultaneously be incorporated.
  • Pinholes are eliminated using the MICROBOND CSI technology.
  • Loss of performance due to bonding errors is reduced to 0.5% - 4%.

Herrmann Ultrasonics has become the technology leader in ultrasonic welding by developing the most advanced products, providing ULTRASONICS ENGINEERING expertise and total solution offerings. The ultrasonic process can be used in the final assembly of the filtration product. Herrmann Ultrasonics is focused on providing ultrasonic welding technology for various markets such as the consumer, medical, food, hygiene and automotive industries. 

For more information visit Herrmann Ultrasonics at Filtration 2017, October 11-12, booth #811, or visit the website at www.herrmannultrasonics.com for the latest ultrasonic news.


Herrmann Ultrasonics

Booth #811

www.herrmannultrasonics.com